TABLE 12.1

Wide Bandgap Material, Fabrication Method, Properties, and Their Applications in Bioelectronics

Wide

bandgap

materials

Fabrication

methods

Fabrication technique

Properties

Applications

II-VI

bottom-up [ 16].

• growth combining with transferring

flexible substrates

• piezoelectric polarization

• biodegradability

• direct bandgap

• sensitive mechanical sensing

• wearable ultraviolet (UV)

photosensor

III-nitride

bottom-up [ 28].

top-down [ 30].

• growth combining with transferring

flexible substrates

• micro/nano- machining combined

with transfer printing

• high electron mobility

• chemical inertness

• high optical transmittance

• sensitive mechanical sensing

• long-term energy scavenger

• optogenetics LED

SiC

bottom-up [ 29].

top-down [ 31].

• growth combining with transferring

flexible substrates

• micro/nano- machining combined

with transfer printing

• chemical inertness

• biocompatibility

• thermal and mechanical robustness

• long-lived recording and sensing

• sensitive mechanical sensing

• radio frequency wireless

communication devices

194

Bioelectronics